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Hydrated chia seed efffect on wheat flour and bread technological quality

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22330%2F15%3A43900759" target="_blank" >RIV/60461373:22330/15:43900759 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Hydrated chia seed efffect on wheat flour and bread technological quality

  • Original language description

    Changes in chemical composition were described by common analytical methods and by rheological properties of non-fermented as well as leavened dough (extensigraph and maturograph tests, respectively). Leavened bread and cut out biscuits were prepared ina laboratory scale. Hydrated white and black chia seeds softly increased protein content and reversely their quality. Due to low amounts added (2.5% or 5.0%), changes in dough viscoelastic properties were small. Consumer quality worsening of both testedproducts was also of low significance, but fibre content increased about 50% compared to wheat control.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    GM - Food industry

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2015

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Agricultural Engeneering International: CIGR Journal - Special issue 2015: 18th World Congress of CIGR

  • ISSN

    1682-1130

  • e-ISSN

  • Volume of the periodical

    2015

  • Issue of the periodical within the volume

    Special Issue 2015

  • Country of publishing house

    JP - JAPAN

  • Number of pages

    5

  • Pages from-to

    259-263

  • UT code for WoS article

  • EID of the result in the Scopus database