Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22340%2F10%3A00023212" target="_blank" >RIV/60461373:22340/10:00023212 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

Original language description

A novel fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is made by micro-milling and a mate with embedded gold electrodesmade by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded togetherby thermally activated solvent bonding. Isopropyl alcohol (IPA) is used as a bonding agent. Using the IPA solvent brings several advantages compared to conventional thermal bonding: (i) decreasing the bonding temperature, (ii) higher bond strength. Decreasing the bonding temperature is crucial for the whole process, because of prevention of electrode cracking, microfluidic channel deformation and clogging. Higher bond strength prevents a liquid leakage and generally improves the microde

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

CI - Industrial chemistry and chemical engineering

OECD FORD branch

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Project

Result was created during the realization of more than one project. More information in the Projects tab.

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2010

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Microelectronic Engineering

ISSN

0167-9317

e-ISSN

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Volume of the periodical

87

Issue of the periodical within the volume

5-8

Country of publishing house

NL - THE KINGDOM OF THE NETHERLANDS

Number of pages

4

Pages from-to

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UT code for WoS article

000276300700232

EID of the result in the Scopus database

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