Hybrid gold-copper stamp for rapid fabrication of microchips
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22340%2F12%3A43893628" target="_blank" >RIV/60461373:22340/12:43893628 - isvavai.cz</a>
Alternative codes found
RIV/49777513:23640/12:43917422
Result on the web
<a href="http://www.sciencedirect.com/science/article/pii/S0167931712003127" target="_blank" >http://www.sciencedirect.com/science/article/pii/S0167931712003127</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.mee.2012.07.030" target="_blank" >10.1016/j.mee.2012.07.030</a>
Alternative languages
Result language
angličtina
Original language name
Hybrid gold-copper stamp for rapid fabrication of microchips
Original language description
We have developed a new alternative way for production of hybrid gold-copper stamps intended for fast and cheap replication of microfluidic structures. This novel technique relies on a polydimethylsiloxane (PDMS) casting process, transfer of microstructures into UV curable methyl-methacrylate (MMA) resin and galvanic deposition. The developed method enables an easy separation of fabricated metal stamps from plastic substrate (mechanical separation or wet etching in organic solvents), which favors this method over the metal stamp fabrication directly on SU8 substrate. The fabricated hybrid gold-copper stamps were tested as embossing templates for production of different microstructures. Their functionality was proven in production of microstructures forseveral applications, e.g.. AC electroosmotic micropumps or dielectrophoretic separators.
Czech name
—
Czech description
—
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
CI - Industrial chemistry and chemical engineering
OECD FORD branch
—
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Microelectronic Engineering
ISSN
0167-9317
e-ISSN
—
Volume of the periodical
98
Issue of the periodical within the volume
1
Country of publishing house
NL - THE KINGDOM OF THE NETHERLANDS
Number of pages
4
Pages from-to
548-551
UT code for WoS article
000309497200122
EID of the result in the Scopus database
—