Adhesively bonded joint analysis with use of acoustic emission

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27230%2F15%3A86095397" target="_blank" >RIV/61989100:27230/15:86095397 - isvavai.cz</a>
Alternative codes found
RIV/61989100:27740/15:86095397
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Adhesively bonded joint analysis with use of acoustic emission
Original language description
Presented paper deals with analysis of adhesively bonded joint with urethane methacrylate-based adhesive, which was subjected to the effect of adhesive aging investigation. The testing procedure consists of compression test of the testing preparation with adhesively bonded joint and simultaneous measurement of acoustic emission activity at two places on testing sample. Obtained experimental results are discussed and compared with datasheet information. Detailed analysis of measured acoustic emission data will be also performed.
Czech name
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Czech description
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Project
<a href="/en/project/ED1.1.00%2F02.0070" target="_blank" >ED1.1.00/02.0070: IT4Innovations Centre of Excellence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Experimental Stress Analysis 2015 : 53rd international conference : June 1-4, 2015, Český Krumlov, Czech Republic : book of extended abstracts
ISBN
978-80-01-05734-6
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
415-418
Publisher name
Czech Technical University in Prague
Place of publication
Praha
Event location
Český Krumlov
Event date
Jun 1, 2015
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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