High Voltage PCBs in Low Pressure and High Temperature Environment

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27240%2F21%3A10248538" target="_blank" >RIV/61989100:27240/21:10248538 - isvavai.cz</a>
Alternative codes found
RIV/61989100:27730/21:10248538
Result on the web
<a href="https://ieeexplore.ieee.org/document/9576958" target="_blank" >https://ieeexplore.ieee.org/document/9576958</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/WZEE54157.2021.9576958" target="_blank" >10.1109/WZEE54157.2021.9576958</a>

Result language
angličtina
Original language name
High Voltage PCBs in Low Pressure and High Temperature Environment
Original language description
This paper describes the issues of high voltage printed circuit boards (PCB) design in environments with lower air pressure and increased temperature. Such ambient conditions have significant impact on breakdown voltage, as it is described by Paschen's curve. As this field was yet to be thoroughly investigated, there are major gaps in available literature. Pashen's curve with temperature corrections, which describes relation between air pressure and breakdown voltage, can be used for clearance estimation only, because it considers a gas as dielectric. In the following paragraphs, overview of printed circuit boards is described with respect to minimization of partial discharge activity and electric breakdown occurrence. (C) 2021 IEEE.
Czech name
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Czech description
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Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 Selected Issues of Electrical Engineering and Electronics : WZEE 2021
ISBN
978-1-66542-164-5
ISSN
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e-ISSN
—
Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
Piscataway
Event location
Řešov
Event date
Sep 13, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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