High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F02%3A07023114" target="_blank" >RIV/68081723:_____/02:07023114 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.
Original language description
The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour.In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JI - Composite materials
OECD FORD branch
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Project
<a href="/en/project/IBS2041001" target="_blank" >IBS2041001: Degradation of properties and lifetime assessment of engineering materials under mechanical loading</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year
2002
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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