Interaction of Silver Nanopowder with Cooper Substrate

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F11%3A00362863" target="_blank" >RIV/68081723:_____/11:00362863 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Interaction of Silver Nanopowder with Cooper Substrate
Original language description
Addition of lead into based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead Into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JG - Metallurgy, metal materials
OECD FORD branch
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Project
<a href="/en/project/GA106%2F09%2F0700" target="_blank" >GA106/09/0700: Thermodynamics and microstructure of environmentally friendly nanoparticle solders</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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