GP5- Modeling and experimental investigation of the microstructural changes in the interdiffusion zone of leadfree solder joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F12%3A00387915" target="_blank" >RIV/68081723:_____/12:00387915 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
GP5- Modeling and experimental investigation of the microstructural changes in the interdiffusion zone of leadfree solder joints
Original language description
The diffusion processes taking part on the interface between the lead-free solder and the substrate were studied experimentally and theoretically. The Phase-field method in combination with thermodynamnic datbases were used to model the development of intermetallic phases at the interface and the properties of such interface were described.
Czech name
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Czech description
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Classification
Type
C - Chapter in a specialist book
CEP classification
BJ - Thermodynamics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/OC08053" target="_blank" >OC08053: Phase equilibria in Zn-Sn-X metallic systems for high-temperature lead-free solders</a><br>
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Book/collection name
Handbook of High-temperature Lead-free Solders: Group Project Reports
ISBN
978-80-905363-3-3
Number of pages of the result
72
Pages from-to
109-180
Number of pages of the book
320
Publisher name
COST office
Place of publication
Brno
UT code for WoS chapter
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