Microstructure of the ultra-fine grained Cu by UHV SLEEM
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081731%3A_____%2F09%3A00335272" target="_blank" >RIV/68081731:_____/09:00335272 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Microstructure of the ultra-fine grained Cu by UHV SLEEM
Original language description
Study of materials with ultra-fine structure belongs nowadays to fronted areas of research of the material engineering. Ultra-fine grained (UFG) materials are defined as polycrystals with very small grains of average grain sizes below 1 micrometer. Thesematerials are very attractive for many industrial applications (including aerospace, automotive, biomaterials, chemical sensors, construction, electronics, metal forming, etc.) because of their interesting mechanical and physical properties surpassing those of common materials. The superior mechanical properties include ultra high strength and superplasticity.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/OE08012" target="_blank" >OE08012: Contrast and detection in scanning electron microscopy</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
MC 2009 - Microscopy Conference: First Joint Meeting of Dreiländertagung and Multinational Conference on Microscopy
ISBN
978-3-85125-062-6
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
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Publisher name
Verlag der Technischen Universität
Place of publication
Graz
Event location
Graz
Event date
Aug 30, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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