Laser system for measuring MEMS relief created by the method of deep reactive ion etching

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081731%3A_____%2F18%3A00498736" target="_blank" >RIV/68081731:_____/18:00498736 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1117/12.2518098" target="_blank" >http://dx.doi.org/10.1117/12.2518098</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1117/12.2518098" target="_blank" >10.1117/12.2518098</a>

Result language
angličtina
Original language name
Laser system for measuring MEMS relief created by the method of deep reactive ion etching
Original language description
The method of laser interferometry is presented appropriate for precise determination of the depth of etching in a deepreactive ion etching system (DRIE), primarily used for the manufacturing of micro-electro-mechanical systems (MEMS). The system uses previous interferometer designs developed at the Institute of Institute of Scientific Instruments of the CAS, v. v. i. (ISI). We designed and manufactured a measurement system for specific MEMS and its functionality verified with the KLATencor D-120 profilometer.
Czech name
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Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
21st Czech-Polish-Slovak Optical Conference on Wave and Quantum Aspects of Contemporary Optics. (Proceedings of SPIE 10976)
ISBN
9781510626072
ISSN
0277-786X
e-ISSN
—
Number of pages
7
Pages from-to
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Publisher name
SPIE
Place of publication
Bellingham
Event location
Lednice
Event date
Sep 3, 2018
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
000455324600021

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