Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO2 matrix

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F15%3A00510812" target="_blank" >RIV/68378271:_____/15:00510812 - isvavai.cz</a>

Alternative codes found

RIV/60076658:12310/15:43888689 RIV/00216208:11320/15:10319610

Result on the web

<a href="https://doi.org/10.1016/j.tsf.2015.07.026" target="_blank" >https://doi.org/10.1016/j.tsf.2015.07.026</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.tsf.2015.07.026" target="_blank" >10.1016/j.tsf.2015.07.026</a>

Result language

angličtina

Original language name

Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO2 matrix

Original language description

Metal nanoparticles embedded into a semiconductive matrix represent a promising material for widely sought advanced technological applications. We focused our interest on the preparation of TiO2 matrix with embedded Cu nanoparticles. In particular, we studied the effect of reactive discharge (Ar/O2) exposition on copper oxidation, which can result in two stable forms.

Czech name

—

Czech description

—

Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

10305 - Fluids and plasma physics (including surface physics)

Project

—

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2015

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Thin Solid Films

ISSN

0040-6090

e-ISSN

—

Volume of the periodical

589

Issue of the periodical within the volume

Aug

Country of publishing house

CH - SWITZERLAND

Number of pages

8

Pages from-to

864-871

UT code for WoS article

000360320000136

EID of the result in the Scopus database

2-s2.0-84940062502