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Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F23%3A00572409" target="_blank" >RIV/68378271:_____/23:00572409 - isvavai.cz</a>

  • Alternative codes found

    RIV/68407700:21220/23:00366029 RIV/00216208:11320/23:10467293

  • Result on the web

    <a href="https://doi.org/10.1016/j.apsusc.2023.157276" target="_blank" >https://doi.org/10.1016/j.apsusc.2023.157276</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1016/j.apsusc.2023.157276" target="_blank" >10.1016/j.apsusc.2023.157276</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films

  • Original language description

    We report a simple and efficient two-step experimental procedure of glass metallization using laser microstructuring at ambient conditions. An adhesive pattern was created on the glass substrate using a laser, which imposes mechanical interlocking. An adhesive Cu layer was deposited on the glass substrate by magnetron sputtering and then electroplated with a functional Cu layer. Due to the unique surface structure created on the glass using laser, we achieved a thick layer of Cu metal film with high adhesion strength, well-defined grains and grain boundaries, and low surface roughness. The total thickness of the grown film was 11.4 µm, with an average surface roughness of 1.2 µm. The magnetron-sputtered coating did not show delamination from the glass substrate at a critical load of 60 N. The proposed method of glass metallization will lead to the realization of glass-based circuit materials that can be used in high-frequency electronic devices. Also, this procedure will be an alternative to chemical-based copper plating, which involves multiple processing steps and high-cost chemicals.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    10306 - Optics (including laser optics and quantum optics)

Result continuities

  • Project

    <a href="/en/project/EF15_006%2F0000674" target="_blank" >EF15_006/0000674: HiLASE Centre of Excellence</a><br>

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2023

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Applied Surface Science

  • ISSN

    0169-4332

  • e-ISSN

    1873-5584

  • Volume of the periodical

    627

  • Issue of the periodical within the volume

    Aug.

  • Country of publishing house

    NL - THE KINGDOM OF THE NETHERLANDS

  • Number of pages

    7

  • Pages from-to

    157276

  • UT code for WoS article

    000988755400001

  • EID of the result in the Scopus database

    2-s2.0-85153573521