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Optical and thermal simulation chain for LED package

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F16%3A00309281" target="_blank" >RIV/68407700:21110/16:00309281 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.1109/EuroSimE.2016.7463349" target="_blank" >http://dx.doi.org/10.1109/EuroSimE.2016.7463349</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/EuroSimE.2016.7463349" target="_blank" >10.1109/EuroSimE.2016.7463349</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Optical and thermal simulation chain for LED package

  • Original language description

    This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JI - Composite materials

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    R - Projekt Ramcoveho programu EK

Others

  • Publication year

    2016

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  • ISBN

    978-1-5090-2106-2

  • ISSN

  • e-ISSN

  • Number of pages

    6

  • Pages from-to

    1-6

  • Publisher name

    IEEE

  • Place of publication

  • Event location

    Montpellier

  • Event date

    Apr 17, 2016

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000381743700057