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Modelling of mold growth on pine and spruce by the logistic equation

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F23%3A00361062" target="_blank" >RIV/68407700:21110/23:00361062 - isvavai.cz</a>

  • Alternative codes found

    RIV/68407700:21720/23:00361062

  • Result on the web

    <a href="https://pubs.aip.org/aip/acp/article/2894/1/020006/2910816/Modelling-of-mold-growth-on-pine-and-spruce-by-the" target="_blank" >https://pubs.aip.org/aip/acp/article/2894/1/020006/2910816/Modelling-of-mold-growth-on-pine-and-spruce-by-the</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1063/5.0163960" target="_blank" >10.1063/5.0163960</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Modelling of mold growth on pine and spruce by the logistic equation

  • Original language description

    This paper deals with modelling of mold growth on wood using the logistic equation. Macroscopic mold coverage fraction was used in the model to express development of molds. Unknown parameters of the logistic model were estimated by finding the best agreement with the current state-of-the-art Finnish mold growth model. Calculations were performed for constant ambient boundary conditions. The estimated values of model parameters were finally expressed as functions of relative humidity and moisture content. The reliability of the proposed logistic model should be tested in the future against the experimental mold growth data.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20101 - Civil engineering

Result continuities

  • Project

    <a href="/en/project/GA20-12941S" target="_blank" >GA20-12941S: Fungal growth on surface layer of solid wood under varying boundary conditions</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2023

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    AIP Conference Proceedings

  • ISBN

    9780735446557

  • ISSN

  • e-ISSN

  • Number of pages

    6

  • Pages from-to

  • Publisher name

    AIP Publishing, APL, the American Institute of Physics

  • Place of publication

    Melville, NY

  • Event location

    Dalešice

  • Event date

    Oct 4, 2022

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article