Modelling of mold growth on pine and spruce by the logistic equation
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F23%3A00361062" target="_blank" >RIV/68407700:21110/23:00361062 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21720/23:00361062
Result on the web
<a href="https://pubs.aip.org/aip/acp/article/2894/1/020006/2910816/Modelling-of-mold-growth-on-pine-and-spruce-by-the" target="_blank" >https://pubs.aip.org/aip/acp/article/2894/1/020006/2910816/Modelling-of-mold-growth-on-pine-and-spruce-by-the</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1063/5.0163960" target="_blank" >10.1063/5.0163960</a>
Alternative languages
Result language
angličtina
Original language name
Modelling of mold growth on pine and spruce by the logistic equation
Original language description
This paper deals with modelling of mold growth on wood using the logistic equation. Macroscopic mold coverage fraction was used in the model to express development of molds. Unknown parameters of the logistic model were estimated by finding the best agreement with the current state-of-the-art Finnish mold growth model. Calculations were performed for constant ambient boundary conditions. The estimated values of model parameters were finally expressed as functions of relative humidity and moisture content. The reliability of the proposed logistic model should be tested in the future against the experimental mold growth data.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20101 - Civil engineering
Result continuities
Project
<a href="/en/project/GA20-12941S" target="_blank" >GA20-12941S: Fungal growth on surface layer of solid wood under varying boundary conditions</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
AIP Conference Proceedings
ISBN
9780735446557
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
AIP Publishing, APL, the American Institute of Physics
Place of publication
Melville, NY
Event location
Dalešice
Event date
Oct 4, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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