Application of Decomposition Theory of the Hole-Drilling Method for Measuring by Semiconductor Strain Gauges

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F14%3A00218396" target="_blank" >RIV/68407700:21220/14:00218396 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Application of Decomposition Theory of the Hole-Drilling Method for Measuring by Semiconductor Strain Gauges
Original language description
This method transforms the stress tensor of the drilled hole position by the regression coefficients and describes the state of strains released in the hole surrounding, based on the hole center distance and its depth. The regress coefficients of this principle are universal both for the isotropic Hooke?s materials and for the other measuring elements. The method defines the way for the processing of the released strains measured with a defined measuring element and involves naturally the influence of the drilled hole eccentricity. The use of semiconductor strain gauges hole drilling rosette, here modifies and simplifies the Decomposition theory of hole-drilling method.
Czech name
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Czech description
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Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
52nd conference on experimental stress analysis 2014
ISBN
978-80-231-0377-6
ISSN
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e-ISSN
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Number of pages
10
Pages from-to
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Publisher name
Výzkumný a zkušební ústav Plzeň s.r.o.
Place of publication
Plzeň
Event location
Marianské Lázně
Event date
Jun 2, 2014
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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