The Evaluation of Adhesion between Electrospun Collagen Layers and Different Titanium Substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F16%3A00304620" target="_blank" >RIV/68407700:21220/16:00304620 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The Evaluation of Adhesion between Electrospun Collagen Layers and Different Titanium Substrates
Original language description
This paper presents an assessment of adhesion of pure collagen electropsun layers to differently prepared and treated titanium surfaces. The aim of project is a development of nanostructured collagen carrier of antibiotics that will provide a bone/implant bioactive interface, which will enhance the physiological healing process, will be capable of filling bone defects, and will act as a powerful antibacterial agent against microorganisms. The collagen/antibiotic layer is applied to titanium surface directly by electrospinning. The performance of such surface layers is affected by the adhesion between the coating and substrate.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
JI - Composite materials
OECD FORD branch
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Result continuities
Project
<a href="/en/project/TA04010330" target="_blank" >TA04010330: Development of resorbable collagen-calcium phosphate nanolayer with controlled elution of antibiotics for implants survival rate enhancement</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů