Design and Simulation of the GaAs Micromechanical Thermal Converter for Microwave Transmitted Power Sensor
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F03%3A03094113" target="_blank" >RIV/68407700:21230/03:03094113 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Design and Simulation of the GaAs Micromechanical Thermal Converter for Microwave Transmitted Power Sensor
Original language description
Thermo mechanical simulations performed with the aim of optimising the temperature distribution of the Micromechanical Thermal Converter (MTC), designed for a Microwave Power Sensor Microsystem
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F03%2F0619" target="_blank" >GA102/03/0619: Smart microsensors and microsystems for measurement, control and environment</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show
ISBN
0-9728422-0-9
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
332-335
Publisher name
Computationg Publications
Place of publication
Cambridge, M.A.
Event location
San Francisco
Event date
Feb 23, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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