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Micromechanical Thermal Converters Compatible with HEMT Technology

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F05%3A03116251" target="_blank" >RIV/68407700:21230/05:03116251 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Micromechanical Thermal Converters Compatible with HEMT Technology

  • Original language description

    This work discusses the thermo mechanical modelling performed with the aim to optimise the temperature distribution of the Microwave Power Sensor microsystem keeping the thermal stress as low as possible

  • Czech name

    Není k dispozici

  • Czech description

    Není k dispozici

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2005

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    WSEAS Transactions on Electronics

  • ISSN

    1109-9445

  • e-ISSN

  • Volume of the periodical

    2005

  • Issue of the periodical within the volume

    3

  • Country of publishing house

    US - UNITED STATES

  • Number of pages

    9

  • Pages from-to

    85-93

  • UT code for WoS article

  • EID of the result in the Scopus database