Adhesive Joining or Lead-Free Soldering?
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F05%3A03124302" target="_blank" >RIV/68407700:21230/05:03124302 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Adhesive Joining or Lead-Free Soldering?
Original language description
Electrically conductive joining and lead free soldering are compared and properties of jointts are evaluated.
Czech name
Vodivé lepení nebo bezolovnaté pájení?
Czech description
Je porovnáno elektricky vodivé lepení a bezolovnaté pájení a jsou vyhodnoceny vlastnosti spojů.
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2005
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Journal of Microelectronics, Electronic Components and Materials
ISSN
0352-9045
e-ISSN
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Volume of the periodical
2005
Issue of the periodical within the volume
4
Country of publishing house
SI - SLOVENIA
Number of pages
8
Pages from-to
228-235
UT code for WoS article
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EID of the result in the Scopus database
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