Electrically Loaded Adhesive Bonds Formed on Different Surfaces
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F07%3A00167845" target="_blank" >RIV/68407700:21230/07:00167845 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Electrically Loaded Adhesive Bonds Formed on Different Surfaces
Original language description
Adhesive bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surface - Cu, immerse Au and Sn.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2007
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ISSE 2007
ISBN
978-1-4244-1217-4
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Cluj-Napoca
Event date
May 9, 2007
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000255232500071