Bismuth(III) Doped Polymer Layers for Telecommunication Applications
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00157318" target="_blank" >RIV/68407700:21230/09:00157318 - isvavai.cz</a>
Alternative codes found
RIV/60461373:22310/09:00021703
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Bismuth(III) Doped Polymer Layers for Telecommunication Applications
Original language description
Bismuth(III)-doped Epoxy Novolak Resin polymer as a novel promising photonics material was designed for applications in 1310 nm telecommunication window. It was fabricated by spin coating on silicon or silica substrates and its optical properties are evaluated in the terms on the Bi(III) concentration.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
The 8th Pacific Rim Conference on Lasers and Electro-Optics
ISBN
978-1-4244-3830-3
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
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Publisher name
CLEO
Place of publication
Washington
Event location
Shanghai
Event date
Aug 30, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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