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Effect of Climatic Cycling on Reliability of Electrically Conductive Adhesives

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00168013" target="_blank" >RIV/68407700:21230/10:00168013 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Effect of Climatic Cycling on Reliability of Electrically Conductive Adhesives

  • Original language description

    In this paper the results of experiments with climatic cycles are presented. Accelerated reliability tests have been focused on aspects of the assembly process on PCB using one-component and two-component ECAs. The aim of experiments was the specification of potential reliability risks of using ECAs in an environment with climatic cycles. According to our measurements, ECAS are generally highly sensitive to climatic cycles. The least dangerous type of cyclic loading is a cycle moist heat - dry heat. During temperature cycles and cycles moist heat - low temperature, structural changes of joints made with one-component adhesive AX 20 were observed. In both cases, cracks were optically detected. Although the change of electrical resistance measured on AX20 adhesive joints was relatively small (6%), temperature cycling provoked creation of cracks in all the joints.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2010

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    POSTER 2010 - Proceedings of the 14th International Conference on Electrical Engineering

  • ISBN

    978-80-01-04544-2

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

  • Publisher name

    ČVUT, Fakulta elektrotechnická

  • Place of publication

    Praha

  • Event location

    Praha

  • Event date

    May 6, 2010

  • Type of event by nationality

    EUR - Evropská akce

  • UT code for WoS article