The Ontology based FMEA of Lead Free Soldering Process

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00171596" target="_blank" >RIV/68407700:21230/10:00171596 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/search/freesrchabstract.jsp?tp=&arnumber=5547322" target="_blank" >http://ieeexplore.ieee.org/search/freesrchabstract.jsp?tp=&arnumber=5547322</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2010.5547322" target="_blank" >10.1109/ISSE.2010.5547322</a>

Result language
angličtina
Original language name
The Ontology based FMEA of Lead Free Soldering Process
Original language description
Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention are discussed. Particular phasesof ontology utilization for development of more exact approach to the FMEA procedure of reflow lead free soldering are analyzed. The goal of our work, a proposal of a user's guide for the FMEA procedure based on an ontology paradigm is presented. This user's guide is included in our university courses Management of Production Quality and Complex Quality Control provided by the Department of Electrotechnology of our faculty.
Czech name
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Czech description
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Project
—
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
33rd International Spring Seminar on Electronics Technology
ISBN
978-1-4244-7849-1
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
360-364
Publisher name
IEEE
Place of publication
New York
Event location
Warsaw
Event date
May 12, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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