Device for Mechanical Bending of Assembled Printed Circuit Boards
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00181812" target="_blank" >RIV/68407700:21230/11:00181812 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Device for Mechanical Bending of Assembled Printed Circuit Boards
Original language description
Article deals with design, construction and usage of a device for mechanic bending of assembled printed circuits boards. Device is designed to test the mechanical reliability of SMD components connection on PCB. Device is specifically focused on mechanical tests of solder joints.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings
ISBN
978-80-214-4303-7
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
25-28
Publisher name
VUT v Brně, FEKT
Place of publication
Brno
Event location
Brno
Event date
Jun 22, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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