Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00184712" target="_blank" >RIV/68407700:21230/11:00184712 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives
Original language description
Electrically conductive adhesives are environmental friendly materials for conductive joining in electronics. Adhesives based on bis-phenol epoxy resin filled with silver flakes with concentration from 65 to 80 % (by wt.) were used for experiments. Conductive joints were formed of these adhesives and thermally aged at the temperature of 120 oC. It was found that the conductivity of adhesives slightly increased after ageing.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging
ISBN
978-1-4577-1275-3
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
305-308
Publisher name
University Politehnica Timisoara
Place of publication
Timisoara
Event location
Timisoara
Event date
Oct 20, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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