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Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00184712" target="_blank" >RIV/68407700:21230/11:00184712 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives

  • Original language description

    Electrically conductive adhesives are environmental friendly materials for conductive joining in electronics. Adhesives based on bis-phenol epoxy resin filled with silver flakes with concentration from 65 to 80 % (by wt.) were used for experiments. Conductive joints were formed of these adhesives and thermally aged at the temperature of 120 oC. It was found that the conductivity of adhesives slightly increased after ageing.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging

  • ISBN

    978-1-4577-1275-3

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    305-308

  • Publisher name

    University Politehnica Timisoara

  • Place of publication

    Timisoara

  • Event location

    Timisoara

  • Event date

    Oct 20, 2011

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article