Electrically Conductive Adhesives Usability for Power Electronic Packaging
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00208964" target="_blank" >RIV/68407700:21230/13:00208964 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Electrically Conductive Adhesives Usability for Power Electronic Packaging
Original language description
Application of electrically conductive adhesives for electronics packaging is joined with many problems. The great one is low endurance against humidity ageing and the combined ageing (humidity+temperature ageing). Five electrically conductive adhesivesbased on epoxy matrix and filled with silver flakes were under test. The limit of the use was found in the penetration of the water molecules into the matrix rezin. Water causes degradation of contacts between filler particles and degradation of the electrical as well as mechanical properties of the adhesive joints.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Diagnostika 2013
ISBN
978-80-261-0210-6
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
18-21
Publisher name
University of West Bohemia
Place of publication
Pilsen
Event location
Pilsen
Event date
Sep 2, 2013
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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