Microstructural investigation on the grain refinement occurring in Cu-doped Ni-Ti thin films

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00213921" target="_blank" >RIV/68407700:21230/14:00213921 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.1016/j.scriptamat.2014.01.021" target="_blank" >http://dx.doi.org/10.1016/j.scriptamat.2014.01.021</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.scriptamat.2014.01.021" target="_blank" >10.1016/j.scriptamat.2014.01.021</a>

Result language

angličtina

Original language name

Microstructural investigation on the grain refinement occurring in Cu-doped Ni-Ti thin films

Original language description

The mechanism of grain refinement in Cu-doped Ni?Ti thin films has been investigated by transmission electron microscopy. Sputter-deposited (Ni,Cu)-rich Ni?Ti?Cu thin films exhibited a columnar structure consisting of grains whose lateral size decreasedwith increasing Cu content. Cu-rich grain boundary segregation was found to become prominent in films containing higher Cu contents. This segregation was attributed to a non-polymorphic crystallization process which lowered the grain growth rate as the Cu content in the films increased.

Czech name

—

Czech description

—

Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JI - Composite materials

OECD FORD branch

—

Project

—

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2014

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Scripta Materialia

ISSN

1359-6462

e-ISSN

—

Volume of the periodical

77

Issue of the periodical within the volume

April

Country of publishing house

US - UNITED STATES

Number of pages

4

Pages from-to

52-55

UT code for WoS article

000333717200014

EID of the result in the Scopus database

—