Laser ablation - fundamentals and application

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221990" target="_blank" >RIV/68407700:21230/14:00221990 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Laser ablation - fundamentals and application
Original language description
The goal of this paper is to present fundamentals of laser ablation, which is the process of removing material from a solid using short (e.g. femtosecond) laser pulses. Laser ablation is potentially interesting for precise object forming in optical glasses that could open door to new fabrication technologies of optical thin films, among others. The process depends on flux received by each point of the surface, as according to the generally accepted Neuenschwander model of ablation. However, there are many secondary aspects that have been recently investigated, making this problem an actual and still unsolved topic. Some of them can be the cut V-groove width and depth, the penetration depth, the property of material, the shape of pulses and spot size, mode distribution incident to the groove cut by the laser and pulse duration.
Czech name
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Czech description
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Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
26th Conference and Exhibition on Optical Communications 2014 Proceedings
ISBN
978-80-86742-39-7
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
39-43
Publisher name
Agentura Action M
Place of publication
Praha
Event location
Praha
Event date
Oct 23, 2014
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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