Reducing Crosstalk in the Internal Structures of Integrated Circuits

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00304043" target="_blank" >RIV/68407700:21230/16:00304043 - isvavai.cz</a>
Result on the web
<a href="http://www.elu.sav.sk/asdam/" target="_blank" >http://www.elu.sav.sk/asdam/</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Reducing Crosstalk in the Internal Structures of Integrated Circuits
Original language description
The advent of novel sub-micron technologies of IC fabrication led to such a decrease in lead-to-lead separation that it is not possible any more to neglect the influence of these leads on the reliability of the system operation. Both the small lead separation and the application of multilayer interconnecting systems cause parasitic electromagnetic couplings; in the case of a unipolar CMOS technology, the capacitive coupling is the dominant effect. It is impossible to measure direct the rapid variations voltage between leads inside the IC.
Czech name
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Czech description
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Project
<a href="/en/project/VG20102015015" target="_blank" >VG20102015015: Miniature intelligent system for analyzing concentrations of gases and pollutants, particularly toxic</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
ASDAM 2016 Conference Proceedings - The 11th International Conference on Advanced Semiconductor and Microsystems
ISBN
978-1-5090-3081-1
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
101-104
Publisher name
Slovenská akademie věd
Place of publication
Bratislava
Event location
Smolenice
Event date
Nov 13, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000392530900025

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