Studying heat transfer on inclined printed circuit boards during vapour phase soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00306429" target="_blank" >RIV/68407700:21230/17:00306429 - isvavai.cz</a>
Result on the web
<a href="http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-11-2016-0029" target="_blank" >http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-11-2016-0029</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1108/SSMT-11-2016-0029" target="_blank" >10.1108/SSMT-11-2016-0029</a>
Alternative languages
Result language
angličtina
Original language name
Studying heat transfer on inclined printed circuit boards during vapour phase soldering
Original language description
Leider was the first to summarize the knowledge on VPS in recent years (Leider, 2002), covering the basic formulation of heat transfer during the process, which was based on the Nusselt theory of filmwise condensation. Leider also investigated different condensation media types, and the dependency of the PCB alignment, from the aspect of vertical and horizontal positioning in the work zone. It was clearly indicated that, with a vertical alignment, the heat transfer coefficient may rise by 25 to 50% depending on the condensation medium. More recently, it was found by Illés that the inclination of the board had a serious effect on the heating, and the heat distribution (Illés, 2016.); the results were obtained from verified modelling software. No actual practical investigation was published about the exact effect of inclination during VP soldering, so a deeper investigation was needed with novel measurement approaches.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Soldering & Surface Mount Technology
ISSN
0954-0911
e-ISSN
1758-6836
Volume of the periodical
29
Issue of the periodical within the volume
1
Country of publishing house
GB - UNITED KINGDOM
Number of pages
8
Pages from-to
34-41
UT code for WoS article
000396464600007
EID of the result in the Scopus database
2-s2.0-85011015050