Advances in Pressure Sensing for Vapour Phase Soldering Process Monitoring
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00327752" target="_blank" >RIV/68407700:21230/19:00327752 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1108/SSMT-10-2018-0038" target="_blank" >https://doi.org/10.1108/SSMT-10-2018-0038</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1108/SSMT-10-2018-0038" target="_blank" >10.1108/SSMT-10-2018-0038</a>
Alternative languages
Result language
angličtina
Original language name
Advances in Pressure Sensing for Vapour Phase Soldering Process Monitoring
Original language description
The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during assembling. In the paper, a special monitoring method is presented for VPS to enable improved process control and oven state identification.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
—
OECD FORD branch
20501 - Materials engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Soldering & Surface Mount Technology
ISSN
0954-0911
e-ISSN
1758-6836
Volume of the periodical
31
Issue of the periodical within the volume
3
Country of publishing house
GB - UNITED KINGDOM
Number of pages
7
Pages from-to
169-175
UT code for WoS article
000479226800005
EID of the result in the Scopus database
2-s2.0-85066868757