Application of More-level Stress on Conductive Adhesive Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338501" target="_blank" >RIV/68407700:21230/19:00338501 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990770" target="_blank" >http://dx.doi.org/10.1109/SIITME47687.2019.8990770</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990770" target="_blank" >10.1109/SIITME47687.2019.8990770</a>
Alternative languages
Result language
angličtina
Original language name
Application of More-level Stress on Conductive Adhesive Joints
Original language description
Three types of stresses have sequentially loaded adhesive joints formed of three types of adhesives with isotropic electrical conductivity. One type of joints has been prepared by mounting of jumpers (0R0 resistors, type 1206) on the test board. The second type of the joints has been formed by the printing of lines from adhesive between neighboring pads. The adhesive joints have been first stressed mechanically by deflection of the board with mounted resistors, then by the thermal shocks -40 oC/+80 oC and then at the combined climate 80 oC/80 % RH for 300 hours. The joints resistance has been measured. The mechanical stress, as well as stress caused by the thermal shocks have had an only low influence on the joints resistance, the combined climate temperature/humidity caused significant changes the joints resistance.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)
ISBN
978-1-7281-3330-0
ISSN
2641-287X
e-ISSN
—
Number of pages
4
Pages from-to
142-145
Publisher name
Politehnica
Place of publication
Bucharest
Event location
Cluj-Napoca
Event date
Oct 23, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000564733700029