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Application of More-level Stress on Conductive Adhesive Joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338501" target="_blank" >RIV/68407700:21230/19:00338501 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990770" target="_blank" >http://dx.doi.org/10.1109/SIITME47687.2019.8990770</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990770" target="_blank" >10.1109/SIITME47687.2019.8990770</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Application of More-level Stress on Conductive Adhesive Joints

  • Original language description

    Three types of stresses have sequentially loaded adhesive joints formed of three types of adhesives with isotropic electrical conductivity. One type of joints has been prepared by mounting of jumpers (0R0 resistors, type 1206) on the test board. The second type of the joints has been formed by the printing of lines from adhesive between neighboring pads. The adhesive joints have been first stressed mechanically by deflection of the board with mounted resistors, then by the thermal shocks -40 oC/+80 oC and then at the combined climate 80 oC/80 % RH for 300 hours. The joints resistance has been measured. The mechanical stress, as well as stress caused by the thermal shocks have had an only low influence on the joints resistance, the combined climate temperature/humidity caused significant changes the joints resistance.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

  • ISBN

    978-1-7281-3330-0

  • ISSN

    2641-287X

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    142-145

  • Publisher name

    Politehnica

  • Place of publication

    Bucharest

  • Event location

    Cluj-Napoca

  • Event date

    Oct 23, 2019

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000564733700029