Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341386" target="_blank" >RIV/68407700:21230/20:00341386 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1108/SSMT-10-2019-0034" target="_blank" >https://doi.org/10.1108/SSMT-10-2019-0034</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1108/SSMT-10-2019-0034" target="_blank" >10.1108/SSMT-10-2019-0034</a>
Alternative languages
Result language
angličtina
Original language name
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
Original language description
Purpose To improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the monitoring heat-level-based vapour phase reflow soldering (VPS), where - as it was found - different thermocouple constructions can affect the set parameters of the oven and resulting soldering profiles significantly. Design/methodology/approach The study experiments showed significant alteration of the heating profiles during the process of the reflowing using different construction of k-type thermocouples. In a heat-level-based VPS oven, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA) gas and water-resistant, fibreglass, thin PFA and ultrathin PFA-covered thermocouples were tested with +/- 1 degrees C precision. The oven parameters were swept according to the heating power; the length of the introduced thermocouple cables was also taken into account. An FR4-based sample PCB was used for monitoring the temperature. Findings According to the results, due to the mass and volume of the thermocouples' wires, different transients were observed on the resulting soldering profiles on the same sample PCB. The thermocouples with lower thermal mass result in faster profiles and significantly different heating factor values compared to the thermocouples that have larger thermal mass. Consequently, the length of the thermocouple wires put in the oven has also considerable effect on the heat transfer of the PCB inside the oven as well. Originality/value The paper shows that the thermocouple construction must be taken into account when setting up a required soldering profile, while the thermal mass of the wires might cause a significant difference in the prediction of the actual and expected soldering temperatures.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
10302 - Condensed matter physics (including formerly solid state physics, supercond.)
Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Soldering & Surface Mount Technology
ISSN
0954-0911
e-ISSN
1758-6836
Volume of the periodical
32
Issue of the periodical within the volume
4
Country of publishing house
GB - UNITED KINGDOM
Number of pages
7
Pages from-to
253-259
UT code for WoS article
000522462900001
EID of the result in the Scopus database
2-s2.0-85082620292