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Dependence of Shear Strength of Adhesive Conductive Joints on Adhesive Modification with the Silver Nanoparticles and Climatic Aging

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00346164" target="_blank" >RIV/68407700:21230/20:00346164 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/SIITME50350.2020.9292188" target="_blank" >https://doi.org/10.1109/SIITME50350.2020.9292188</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/SIITME50350.2020.9292188" target="_blank" >10.1109/SIITME50350.2020.9292188</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Dependence of Shear Strength of Adhesive Conductive Joints on Adhesive Modification with the Silver Nanoparticles and Climatic Aging

  • Original language description

    The dependence of the shear strength of adhesive joints formed from electrically conductive adhesive was inspected. All adhesives had isotropic electrical conductivity and were based on an epoxy matrix filled with silver flakes. The adhesives were modified with silver nanoparticles. The aging of the joints at the high temperature was also carried out. It was found different dependence of the shear strength for joint made from adhesives of different manufacturers.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20505 - Composites (including laminates, reinforced plastics, cermets, combined natural and synthetic fibre fabrics; filled composites)

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Published in: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)

  • ISBN

    978-1-7281-7506-5

  • ISSN

  • e-ISSN

    2642-7036

  • Number of pages

    4

  • Pages from-to

    331-334

  • Publisher name

    University of Pitesti

  • Place of publication

    Pitesti

  • Event location

    online

  • Event date

    Oct 19, 2020

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article