Bond Strength Test of Soldering Pads with Various Surface Finishes Performed under Different Thermal Conditions
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00346642" target="_blank" >RIV/68407700:21230/20:00346642 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE49702.2020.9121111" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9121111</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121111" target="_blank" >10.1109/ISSE49702.2020.9121111</a>
Alternative languages
Result language
angličtina
Original language name
Bond Strength Test of Soldering Pads with Various Surface Finishes Performed under Different Thermal Conditions
Original language description
The goal of this study is to evaluate the bond between the soldering pad and the substrate in dependence on the solder pad finish as well as on ambient temperature. Stated differently, measuring of pulling force necessary for detaching the pad from the substrate is a subject of submitted study. A conventional substrate (laminate) made of woven glass cloth and epoxy resin with glass transition temperature value of 135 °C was available. OSP and HASL were chosen as surface finishes for evaluating the impact on the studied concern. Bond strength test was performed in room temperature and at an elevated temperature around 60 °C. An influence of IMC layers on test performing and results is included. Achieved results suggest a difference in the rate of adhesion of soldering pad to the substrate considering surface finish. However, other testing variables don't affect the pad adhesion significantly.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE Press
Place of publication
New York
Event location
Demanovska Valley
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500065