Analysis of a failure in a molded package caused by electrochemical migration

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00349986" target="_blank" >RIV/68407700:21230/21:00349986 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1016/j.engfailanal.2020.105128" target="_blank" >https://doi.org/10.1016/j.engfailanal.2020.105128</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.engfailanal.2020.105128" target="_blank" >10.1016/j.engfailanal.2020.105128</a>

Result language

angličtina

Original language name

Analysis of a failure in a molded package caused by electrochemical migration

Original language description

Electrical components can fail during their function in an electrical circuit, especially in a harsh environment. One of the possible failure reasons is the electrochemical migration, which leads to a short circuit or change of electrical parameters of components. This paper focuses on electrochemical effects and explains mechanisms leading to the formation of a conductive path within a component molded in a plastic package. Appropriate diagnostic methods SEM/EDS and penetration tests have been chosen in order to find the root cause for short circuit creation. It was found that the conductive path appeared due to electrochemical migration of silver between the Electrically Conductive Adhesive (ECA) joints connecting the capacitor package. A tiny gap that was found between the molding compound and the leadframe of the package, showed to be the necessary condition for the electrochemical migration to appear. The main aim of this work was not just to identify the cause of an inadvertent conductive path creation, but also to identify the part of the manufacturing process, where similar problems can be prevented.

Czech name

—

Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Engineering Failure Analysis

ISSN

1350-6307

e-ISSN

1873-1961

Volume of the periodical

121

Issue of the periodical within the volume

105128

Country of publishing house

NL - THE KINGDOM OF THE NETHERLANDS

Number of pages

8

Pages from-to

1-8

UT code for WoS article

000613158000005

EID of the result in the Scopus database

2-s2.0-85098688238