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Stereolithography Resins with Conductive Fillers: An Effective Way to Enhance their Electrical Properties

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00352324" target="_blank" >RIV/68407700:21230/21:00352324 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/ISSE51996.2021.9467669" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467669</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467669" target="_blank" >10.1109/ISSE51996.2021.9467669</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Stereolithography Resins with Conductive Fillers: An Effective Way to Enhance their Electrical Properties

  • Original language description

    The recent expansion of 3D printing caused an increase in requirements of printable materials. Since most materials with sufficient electrical properties are not suitable for 3D printing at home or are financially inaccessible, we seek better alternatives. Here, we report modification of electrical properties of commercially available stereolithography (SLA) photopolymer resin by addition of graphite powder and Fe3O4 nanoparticles. Modified resins were prepared via direct ultrasonication of resin containing up to 5 wt% of fillers. Such resins were immediately used for printing to prevent sedimentation. Printed samples were used for the measurements of DC resistivity, dielectric permittivity, and dielectric loss. The obtained data show promising trends since the resistivity decreased with higher filler content. The increase in dielectric permittivity led to increase in dissipation factor.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2021

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2021 44th International Spring Seminar on Electronics Technology (ISSE)

  • ISBN

    978-1-6654-1477-7

  • ISSN

  • e-ISSN

    2161-2528

  • Number of pages

    4

  • Pages from-to

    1-4

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Bautzen

  • Event date

    May 5, 2021

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article