Work-in-Progress: Determining MPSoC Layout from Thermal Camera Images
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00353349" target="_blank" >RIV/68407700:21230/21:00353349 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21730/21:00353349
Result on the web
<a href="https://doi.org/10.1145/3477244.3477619" target="_blank" >https://doi.org/10.1145/3477244.3477619</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1145/3477244.3477619" target="_blank" >10.1145/3477244.3477619</a>
Alternative languages
Result language
angličtina
Original language name
Work-in-Progress: Determining MPSoC Layout from Thermal Camera Images
Original language description
In many safety-critical applications, Multi-Processor Systems-on- Chip (MPSoC) must operate within a given thermal envelope under harsh environmental conditions. Meeting the thermal requirements often requires using advanced task allocation and scheduling techniques that are guided by detailed power models. This paper introduces a method that has the potential to simplify the creation of such models. It constructs so-called heat maps from thermal camera images. By comparing the heat maps of different workloads, we identify the locations of on-chip components and the amount of heat produced by them. We demonstrate our method on the i.MX8QuadMax chip from NXP, where we identify the locations of CPU clusters, bigger CPU cores, GPUs, and DRAM controllers.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
10201 - Computer sciences, information science, bioinformathics (hardware development to be 2.2, social aspect to be 5.8)
Result continuities
Project
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Continuities
R - Projekt Ramcoveho programu EK
Others
Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
EMSOFT '21: Proceedings of the 2021 International Conference on Embedded Software
ISBN
978-1-4503-8712-5
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
39-40
Publisher name
Association for Computing Machinery
Place of publication
New York
Event location
Virtual
Event date
Oct 8, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000724136100011