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Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00356340" target="_blank" >RIV/68407700:21230/21:00356340 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/SIITME53254.2021.9663585" target="_blank" >https://doi.org/10.1109/SIITME53254.2021.9663585</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/SIITME53254.2021.9663585" target="_blank" >10.1109/SIITME53254.2021.9663585</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging

  • Original language description

    The article is focused on the calculation of mathematical models for the calculation of the resistance of adhesive joints from adhesives of four manufacturers made on pads with Cu and Ag surface finish. Aging is performed in a combined climate of elevated humidity / elevated temperature. Factor experiment technique was used to calculate the models. The created models showed good agreement with the measured data.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20505 - Composites (including laminates, reinforced plastics, cermets, combined natural and synthetic fibre fabrics; filled composites)

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2021

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

  • ISBN

    978-1-6654-2110-2

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    160-164

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Timisoara

  • Event date

    Oct 25, 2021

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000786441900038