Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00362935" target="_blank" >RIV/68407700:21230/22:00362935 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE54558.2022.9812817" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812817</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812817" target="_blank" >10.1109/ISSE54558.2022.9812817</a>
Alternative languages
Result language
angličtina
Original language name
Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints
Original language description
In this work, the resistance of joints formed by two types of conductive adhesives with isotropic electrical conductivity on pads with copper and gold surface finish is monitored. The joints are climatically loaded by heat shocks and exposure to elevated temperature and humidity. The method of factor experiments and Taguchi's orthogonal arrays are used to determine which of these climatic factors has a more significant effect on the change in joint resistance. It was found that the dominant aging factor differs for different adhesives and that the results obtained by both methods are close in cases where the effect of factor interactions on the joint resistance is small.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2022 45th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-6589-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE Press
Place of publication
New York
Event location
Vienna
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200058