APPARATUS FOR REMOVING COMPONENTS FROM PRINTED CIRCUIT BOARDS AND A METHOD FOR REMOVING COMPONENTS IN THIS APPARATUS
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00371578" target="_blank" >RIV/68407700:21230/23:00371578 - isvavai.cz</a>
Result on the web
<a href="https://worldwide.espacenet.com/patent/search/family/074165838/publication/EP3846605B1?q=EP3846605B1" target="_blank" >https://worldwide.espacenet.com/patent/search/family/074165838/publication/EP3846605B1?q=EP3846605B1</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
APPARATUS FOR REMOVING COMPONENTS FROM PRINTED CIRCUIT BOARDS AND A METHOD FOR REMOVING COMPONENTS IN THIS APPARATUS
Original language description
The present invention relates to the field of removing bonded and soldered components from the surface of printed circuit boards, in particular, those of mobile electronic devices such as mobile phones, tablets, laptops, personal portable computing units, so-called handhelds, and others
Czech name
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Czech description
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Classification
Type
P - Patent
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Patent/design ID
EP3846605
Publisher
EPO_1 -
Publisher name
European Patent Office
Place of publication
Munich, The Hague, Berlin, Vienna, Brussels
Publication country
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Date of acceptance
Aug 2, 2023
Owner name
ČVUT v Praze
Method of use
A - Výsledek využívá pouze poskytovatel
Usage type
A - K využití výsledku jiným subjektem je vždy nutné nabytí licence