Vapour phase reflow soldering with vertical assembly stacking to improve productivity

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00388785" target="_blank" >RIV/68407700:21230/25:00388785 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1016/j.rineng.2025.104414" target="_blank" >https://doi.org/10.1016/j.rineng.2025.104414</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.rineng.2025.104414" target="_blank" >10.1016/j.rineng.2025.104414</a>

Result language

angličtina

Original language name

Vapour phase reflow soldering with vertical assembly stacking to improve productivity

Original language description

During vapour phase soldering, the lateral size of the specimen tray determines the number of assemblies that can be soldered at once. Our research aimed to find out how we can increase the productivity of an industrial-grade oven, improve the technology for a more energy-efficient production without significant retrofitting modifications, and validate the results by investigating the soldering quality on surface-mounted components. The productivity of the oven tripled by stacking the soldered assemblies. Furthermore, a tray with reduced thermal mass was applied, which shortened the cycle time by 20 %. Comparative tests were performed between several vertical configurations and the default setup of the oven. The resulting thermal profiles were analysed, and the quality of the solder joints was assessed by wetting and shear tests, as well as their microstructure on cross-sections. A new model of the intermetallic layer growth in the liquid phase was established, which showed that not only the transferred heat energy and the time above liquidus values, but also the heating rate affects the intermetallic layer growth in the liquid phase of the solder alloy during the vapour phase soldering process. The application of the stacking and the modified tray increased the productivity by 360 % with only a minor decrease in the shear strength of the solder joint (by 13–18 %), mainly due to increased void formation and reduced wetting; however, the overall product quality still fit the requirements of commercial electronics.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2025

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Results in Engineering

ISSN

2590-1230

e-ISSN

2590-1230

Volume of the periodical

25

Issue of the periodical within the volume

March

Country of publishing house

AT - AUSTRIA

Number of pages

9

Pages from-to

1-9

UT code for WoS article

001434758300001

EID of the result in the Scopus database

2-s2.0-85218472151