Properties of Adhesive Bonds Exposed to the Static and Dynamic Mechanical Load
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F03%3A03090305" target="_blank" >RIV/68407700:21340/03:03090305 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Properties of Adhesive Bonds Exposed to the Static and Dynamic Mechanical Load
Original language description
Two types of mechanical load have been applied static load and dynamic one. The load has been induced by a definite deflection of PCB after mounting of the resistots with zero resistance by the use of electrically conductive adhesives.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
26th International Spring Seminar on Electronics Technology
ISBN
0-7803-8002-9
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
412-416
Publisher name
Technical University of Košice
Place of publication
Košice
Event location
High Tatras, Slovakia
Event date
May 8, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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