Debonding of Special Bracket with Tm:YAP Microchip Laser
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F10%3A00171288" target="_blank" >RIV/68407700:21340/10:00171288 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Debonding of Special Bracket with Tm:YAP Microchip Laser
Original language description
The purpose of the study was to determine temperature increase and tensile strength needed for bracket debonding with and without laser irradiation. The continuously running laser - 2 ?m Tm:YAP with the power 1 W acting for 60 s was used.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
BH - Optics, masers and lasers
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Lasers in Medical Science
ISSN
0268-8921
e-ISSN
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Volume of the periodical
25
Issue of the periodical within the volume
Suppl 1
Country of publishing house
GB - UNITED KINGDOM
Number of pages
1
Pages from-to
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UT code for WoS article
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EID of the result in the Scopus database
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