Tm:YAP Microchip Laser for Debonding Ceramic Orthodontic Brackets - Bond Strengths Measurement
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F11%3A00185116" target="_blank" >RIV/68407700:21340/11:00185116 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1007/s10103-011-0999-6" target="_blank" >http://dx.doi.org/10.1007/s10103-011-0999-6</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1007/s10103-011-0999-6" target="_blank" >10.1007/s10103-011-0999-6</a>
Alternative languages
Result language
angličtina
Original language name
Tm:YAP Microchip Laser for Debonding Ceramic Orthodontic Brackets - Bond Strengths Measurement
Original language description
The aim of our study was to evaluate the influence of the laser radiation for bracket debonding without changes in the enamel structure. The laser system was a longitudinally diode-pumped Tm:YAP laser operating at 1997 nm. The bracket with the tooth sample was heated by laser light and after the chosen time interval the bracket was removed mechanically from the tooth surface. The digital force gauge measured bond strength.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
BH - Optics, masers and lasers
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů