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Tm:YAP Microchip Laser for Debonding Ceramic Orthodontic Brackets - Bond Strengths Measurement

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F11%3A00185116" target="_blank" >RIV/68407700:21340/11:00185116 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.1007/s10103-011-0999-6" target="_blank" >http://dx.doi.org/10.1007/s10103-011-0999-6</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1007/s10103-011-0999-6" target="_blank" >10.1007/s10103-011-0999-6</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Tm:YAP Microchip Laser for Debonding Ceramic Orthodontic Brackets - Bond Strengths Measurement

  • Original language description

    The aim of our study was to evaluate the influence of the laser radiation for bracket debonding without changes in the enamel structure. The laser system was a longitudinally diode-pumped Tm:YAP laser operating at 1997 nm. The bracket with the tooth sample was heated by laser light and after the chosen time interval the bracket was removed mechanically from the tooth surface. The digital force gauge measured bond strength.

  • Czech name

  • Czech description

Classification

  • Type

    O - Miscellaneous

  • CEP classification

    BH - Optics, masers and lasers

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů