Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21670%2F08%3A15152671" target="_blank" >RIV/68407700:21670/08:15152671 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip
Original language description
3D silicon sensors with electrodes penetrating the full substrate thickness, different electrode configurations and with active edges, where bump-bonded to the ATLAS pixel readout chip FE-I3 in 2006. Their characterization included electrical tests in laboratory, tests with beam and radioactive sources. Noise figures after bump bonding varied from 190 to 290 electrons, in agreement with the different electrode density of the three 3D configurations. This paper will reports beam results on the edge sensitivity, electrode response and efficiency at different angles of 3D sensors, fabricated at Stanford and bump-bonded to the ATLAS FE-I3 front end chip, before and after irradiation to 1015 high energy protons per cm2.
Czech name
Charakterizace hran 3D kremikoveho detektoru po Bump-Bondingu s ATLAS Pixel Readout Chipem
Czech description
Clanek pojednava o charakterizaci hran 3D kremikoveho detektoru po Bump-Bondingu s ATLAS Pixel Readout Chipem
Classification
Type
D - Article in proceedings
CEP classification
BG - Nuclear, atomic and molecular physics, accelerators
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Conference Record of the 2008 IEEE NSS/MIC/RTSD
ISBN
978-1-4244-2715-4
ISSN
1082-3654
e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
Omipress
Place of publication
Wisconsin
Event location
Dresden
Event date
Oct 19, 2008
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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