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Attachment/detachment of Saccharomyces cerevisiae on plasma deposited organosilicon thin films

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28110%2F06%3A63504770" target="_blank" >RIV/70883521:28110/06:63504770 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Attachment/detachment of Saccharomyces cerevisiae on plasma deposited organosilicon thin films

  • Original language description

    Bio-interactive and bio-inert materials prepared by plasma deposition of organosilicon thin films on polycarbonate substrates were studied and described in this communication. The atmospheric pressure surface barrier discharge was applied. Nitrogen withsmall admixture of hexamethyldisiloxane (HMDSO) was used as plasma discharge gas. The zeta potential measurement followed by cell adhesion to polystyrene was used to find optimal values of stability of the cell suspension and cell adhesion to the testedsurfaces. The samples of plasma deposited layers were characterized by contact angle measurement.

  • Czech name

    Adsorpce/desorpce Saccharomyces Cerevisiae na plazmou deponovaných organokřemičitých tenkých vrstvách

  • Czech description

    Bio-interaktivní a bio-inertní materiály připravené pomocí depozice organokřemičitých vrstev v plazmatu na povrchu polykarbonátu byly studovány a popsány v tomto příspěvku. Dusík s malou příměsí hexamethyldisiloxanu byl použit jako plazmový plyn.

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    BL - Plasma physics and discharge through gases

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2006

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    22nd Symposium on Plasma Physics and Technology

  • ISBN

    80-01-03506-9

  • ISSN

  • e-ISSN

  • Number of pages

    1

  • Pages from-to

    86

  • Publisher name

    Vydavatelství ČVUT

  • Place of publication

    Praha

  • Event location

  • Event date

  • Type of event by nationality

  • UT code for WoS article