Novel water based cutting fluids for saw technology

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28110%2F10%3A63509272" target="_blank" >RIV/70883521:28110/10:63509272 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Novel water based cutting fluids for saw technology
Original language description
Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC)in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System´s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning ofmodern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of th
Czech name
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Czech description
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Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 12 th Scientific and Business Conference SILICON 2010
ISBN
978-80-254-7361-0
ISSN
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e-ISSN
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Number of pages
8
Pages from-to
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Publisher name
TECON Scientific, spol. s r. o.
Place of publication
Rožnov pod Radhoštěm
Event location
Rožnov pod Radhoštěm
Event date
Jan 1, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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