Component Package Decapsulation Process With Analogue Signature Analysis Support

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F14%3A43871455" target="_blank" >RIV/70883521:28140/14:43871455 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Component Package Decapsulation Process With Analogue Signature Analysis Support
Original language description
Paper deals with the problem of considerate electronic component package opening for failure analysis purposes. That opening makes the system on chip accessible for detailed optical inspection as well as for electrical tests accompanied with surface events observation. The notion for such kind of package selective opening is called decapsulation, and the paper mentions the main techniques of that. The laser decapsulation technique is described in relation to experiments aimed at the proper process programming supported with analogue signature analysis. Illustrating pictures accompany the experiments of process development.
Czech name
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Czech description
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Project
<a href="/en/project/ED2.1.00%2F03.0089" target="_blank" >ED2.1.00/03.0089: The Centre of Security, Information and Advanced Technologies (CEBIA-Tech)</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 14th International Conference on Robotics, Control and Manufacturing Technology
ISBN
978-960-474-371-1
ISSN
1790-5117
e-ISSN
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Number of pages
6
Pages from-to
112-117
Publisher name
WSEAS press
Place of publication
Penang
Event location
Kuala Lumpur
Event date
Apr 23, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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