Temperature stability of injection moulded low-density polyethylene parts modified by accelerated electrons

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F22%3A63558418" target="_blank" >RIV/70883521:28140/22:63558418 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10017954" target="_blank" >https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10017954</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/CSCC55931.2022.00018" target="_blank" >10.1109/CSCC55931.2022.00018</a>

Result language
angličtina
Original language name
Temperature stability of injection moulded low-density polyethylene parts modified by accelerated electrons
Original language description
Low-density polyethylene is one of the most widely used polymer materials, due to its easy workability and its properties, in particular, it excels in chemical resistance. The reason why it is often not used in technical applications is its limited mechanical properties and low temperature stability. One of the ways to improve these properties (especially temperature stability) is a physical modification by radiation cross-linking (accelerated electrons). The properties of already finished injection moulded products can be changed depending on the radiation dose. This is confirmed by the results of measurements of temperature stability and mechanical properties. With increasing radiation dose (highest used radiation dose 198 kGy), the temperature stability of low-density polyethylene increases significantly, but the tensile properties improve only slightly.
Czech name
—
Czech description
—

Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2022 26th International Conference on Circuits, Systems, Communications and Computers (CSCC)
ISBN
978-1-66548-186-1
ISSN
—
e-ISSN
—
Number of pages
6
Pages from-to
45-50
Publisher name
IEEE Computer Society Conference Publishing Services (CPS)
Place of publication
Washington, DC
Event location
Chania
Event date
Jul 19, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)